In this section, you can access to the latest technical information related to the FUTURE project topic.

LARGE PANEL LEVEL FAN-OUT PACKAGING METHOD AND LARGE PANEL LEVEL FAN-OUT PACKAGING STRUCTURE

A large panel level fan-out packaging method and a large panel level fan-out packaging structure. The large panel level fan-out packaging method comprises: providing a temporary carrier (1) and a plurality of dies (3), pasting the plurality of dies (3) onto the temporary carrier (1), and cutting same into blocks to form cut frame dies (A); carrying out surface treatment on the dies (3) on each cut frame die (A), and arranging and tiling the plurality of cut frame dies (A); manufacturing a frame (4), and attaching the frame (4) to the tiled temporary carrier (1), wherein the frame (4) covers the gap between two adjacent tiled cut frame dies (A), and the plurality of dies (3) are all exposed out of the frame (4); carrying out plastic package on the plurality of dies (3), and separating the temporary carrier (1) to obtain a die plastic package; and electrically leading out I/O ports of the plurality of dies (3) from both sides of the die plastic package.


» Number: WO2025002311A1 (A1)

» Publication Date: 02/01/2025

» Applicant: GUANGDONG FOZHIXIN MICROELECTRONICS TECH RESEARCH CO LTD?[CN]

» Inventor: HUA XIANGANG?[CN]; YANG BIN?[CN] (1)

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