In this section, you can access to the latest technical information related to the FUTURE project topic.

CONDUCTIVE DIE ATTACH COMPOSITIONS

Provided herein is a conductive die attach composition comprising: A resin comprising those containing one or more maleimide, itaconimide or nadimide functional groups or combinations of said functional groups; An epoxy component; A (meth)acrylate component; An aromatic anhydride; and A conductive filler.


» Number: WO2024229469A1 (A1)

» Publication Date: 07/11/2024

» Applicant: HENKEL AG & CO KGAA?[DE]; BIN LINA?[US]

» Inventor: BIN LINA?[US]; HONG XUAN?[US] (2)

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