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LASER ACTIVATION-BASED COPPER PLATING PROCESS FOR 3D-PRINTED CERAMIC SURFACE

The present invention belongs to the technical field of special materials. Disclosed is a laser activation-based copper plating process for a 3D-printed ceramic surface. In the present invention, a special-shaped alumina substrate is prepared by means of the advantages of additive manufacturing, and then the surface of a ceramic substrate is "activated" by means of a laser pretreatment. Finally, combined with an electroless copper plating process, the directional controllable metallization of the surface of the ceramic substrate of a three-dimensional shape is achieved at room temperature, and a high-precision densely packed copper layer which has good reproducibility is obtained. The obtained coating has satisfactory roughness, excellent bonding force and stability, and good solderability. The resistivity of the copper layer measured by a four-probe resistance meter is about 3.1 m??cm, and the limit line width of a metal circuit is about 33.2 ?m. The process may be widely used in electronic and radio frequency circuit industries, such as high-power light-emitting diodes (LEDs), integrated circuits, filters, etc.


» Number: WO2022227118A1 (A1)

» Publication Date: 03/11/2022

» Applicant: NANJING UNIV OF AERONAUTICS AND ASTRONAUTICS?[CN]

» Inventor: SHEN LIDA?[CN]; LU BIN?[CN] (3)

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