In this section, you can access to the latest technical information related to the FUTURE project topic.

Effect of Diffusion Bonding Temperature on the Microstructure and Interfacial Shear Strength of TA15/Cemented Carbide Composite Plate with V/Fe Composite Intermediate Layers

This study investigates preparation of TA15/WC?xCo laminated composites, aiming to combine titanium's toughness with carbide's wear resistance. V/Fe intermediate layers is used to enhance interface bonding. Results show the interlayer promotes metallurgical bonding, with maximum shear strength of 166?MPa at 940?°C, and increasing Co content improves bonding strength. This provides a theoretical basis for high?performance composites.The preparation of titanium alloy/cemented carbide bimetallic laminated composites is expected to integrate the high strength and toughness of titanium alloy with the wear resistance of cemented carbide, presenting significant application potential in national defense and other fields. A key requirement for the application of lamellar composite materials is stable and effective interface bonding properties. Adding an intermediate transition layer is an effective method for achieving high interface bonding strength. In this study, V/Fe composite intermediate layers is chosen as the intermediate layer between TA15 and tungsten–cobalt carbide. The effects of diffusion bonding temperatures and the Co content in the cemented carbide on the interface structure and interface shear strength are investigated. The results show that the V/Fe interlayer effectively facilitates the metallurgical bonding of TA15 and cemented carbide. The interface bonding strength can reach 166?MPa. As the bonding temperature increases, the interface bond strength of TA15/cemented carbide composite plates first increases and then decreases, peaking at 940?°C. At this temperature, the interfacial shear strength rises with increasing Co content. This study provides a theoretical foundation for preparing titanium alloy/cemented carbide laminated composite plates with good interface bonding properties.

» Author: Yuhe Tian, Junjie Li, Weijun He, Shengwen Bai, Jun Peng, Bin Jiang

» Publication Date: 09/03/2025

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