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Methods, apparatus, and system for high-bandwidth on-mold antennas

A semiconductor device comprising an on-mold antenna for transmitting and/or receiving a millimeter-wave radio frequency signal is provided. The semiconductor device includes a semiconductor layer; a polymer layer proximal to the semiconductor layer; a mold proximal to the polymer layer; a plurality of nodes proximal to the semiconductor layer and distal to the polymer layer; an antenna disposed on the mold; and a conductive element providing electrical communication between the antenna and a first node. The mold may be from 500 ?m to 1000 ?m thick, such as from 750 ?m to 800 ?m thick, such as about 775 ?m.


» Number: US10594356B1 (B1)

» Publication Date: 17/03/2020

» Applicant: GLOBALFOUNDRIES INC?[KY]

» Inventor: HALIM SAQUIB BIN?[DE]; BIN RAHIM MD SAYED KAYSAR?[US] (1)

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