In this section, you can access to the latest technical information related to the FUTURE project topic.

Rapid and low temperature sintering bonding using Cu nanoparticle film for power electronic packaging

It is of great interest but very difficult to achieve both rapid (few minutes) and low temperature (

» Author: Yongchao Wu, Guisheng Zou, Shuaiqi Wang, Wei Guo, Hongqiang Zhang, Peng Peng, Bin Feng, Lei Liu

» More Information

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